Heat transfer is one of our main core areas of expertise. The approach taken to solve any heat transfer problem is by firstly understanding all the thermal resistances circuit on the heat path to assess which is the most efficient way to modify them in order to maximise heat transfer and also characterising all the types of heat transfer involved, in regards of conduction, convection or radiation. The heat transfer challenges solved in the past can range from understanding heat transfer in a print head and enhancing it to large machinery for semiconductor processing where very large shell and tube plastic heat exchangers had to be used due to the chemicals involved. Some more common applications experienced in the past are heat sink design and optimisation and electronic enclosure cooling.
Heat sink simulation is used to determine the performance of the heat sink in terms of thermal resistance, as well as the pressure drop, depending on the flow rate and position of the fan in the assembly. Heat sinks come in a variety of types, depending on the performance required, the main function that will dictate the material and the manufacturing technology used.
Electronic enclosure cooling is often needed to determine the temperature of the electronic components and to specify the optimum cooling fans required, depending on the pressure drop across the electronic casing.