High-density USB-C hub enclosure design, electronics packaging, internal thermal management and production-oriented mechanical integration.
Cambrionix ThunderSync3-C10 USB-C hub – public product image showing the externally visible enclosure and product packaging.
Overview
Mechanical enclosure design and thermal packaging support for the Cambrionix ThunderSync3-C10, a compact high-density USB-C hub. The work combined plastic enclosure development, electronics packaging, connector integration and internal thermal-management considerations within a production-ready product architecture.
Engineering Challenge
The product required a compact enclosure capable of accommodating multiple high-power USB-C ports, dense electronics and practical user-facing connector access. The design needed to maintain connector alignment, manufacturability, assembly practicality and effective heat dissipation within limited available space.
Engineering Scope
- Designed the plastic enclosure and mechanical packaging in SolidWorks.
- Integrated PCB, connector layout and assembly constraints into the product architecture.
- Developed the internal thermal-management strategy for the compact enclosure.
- Evaluated practical heat dissipation paths within the product packaging.
- Assessed passive and forced-cooling approaches against manufacturability and assembly requirements.
- Supported production-oriented mechanical integration for the final product configuration.
Enclosure and Mechanical Packaging
The mechanical design work focused on converting the product requirements into a compact enclosure suitable for production. This included the arrangement of internal electronics, alignment of external connector openings, enclosure part design, assembly method, fastening approach and practical manufacturing constraints.
Thermal Management Strategy
Thermal behaviour was assessed to identify key heat-generating components and define practical heat dissipation paths through the compact enclosure. The cooling approach was selected to keep the solution simple, robust and suitable for production while supporting reliable operation within the available product envelope.
Production and Application Context
The ThunderSync3-C10 was later publicly announced as certified and deployed for use aboard the International Space Station. The case study is therefore limited to externally visible product information and high-level mechanical and thermal engineering scope, without disclosing confidential internal design details.
Outcome
- Delivered enclosure design and mechanical integration support for the ThunderSync3-C10.
- Defined and implemented an internal thermal-management approach for a compact high-density electronics product.
- Supported production-oriented mechanical packaging, connector alignment and assembly integration.
- Contributed to a product later publicly announced as certified and deployed for use aboard the International Space Station.
- Demonstrated capability in electronics packaging, enclosure design and thermal-management support for compact instrumentation hardware.
Confidentiality Note
This case study uses public product imagery and describes the work at a high level. No confidential internal CAD data, detailed component layouts, proprietary design dimensions, thermal calculation inputs or restricted project documentation are disclosed.